POLYIMIDE PRECURSOR RESIN COMPOSITION

PROBLEM TO BE SOLVED: To provide a resin composition which enables formation of a cured film with low stress and resistance to swelling and a method of producing such a cured film.SOLUTION: A resin composition includes (a) and (b) components: (a) is a polyimide precursor; and (b) a metal complex com...

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Main Authors ONO TAKASHI, SUZUKI ETSUHARU, ENOMOTO TETSUYA, OE TADAYUKI, SOEJIMA KAZUYA, SUZUKI KEIKO
Format Patent
LanguageEnglish
Published 03.07.2014
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:PROBLEM TO BE SOLVED: To provide a resin composition which enables formation of a cured film with low stress and resistance to swelling and a method of producing such a cured film.SOLUTION: A resin composition includes (a) and (b) components: (a) is a polyimide precursor; and (b) a metal complex compound represented by general formula (2), where R, R, R, R, Rand Rindependently represent a hydrogen atom or a univalent organic group.
Bibliography:Application Number: JP20120279342