LASER DICING METHOD, METHOD OF MANUFACTURING CHIP AND LASER PROCESSING APPARATUS

• Main Authors: RYU KOSHUN, MARUYAMA SO
• Format: Patent
• Language: English
• Published: 30.06.2014
• Subjects: BASIC ELECTRIC ELEMENTS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM; WORKING CEMENT, CLAY, OR STONE; WORKING STONE OR STONE-LIKE MATERIALS

PROBLEM TO BE SOLVED: To provide a laser dicing method for dividing a crystal substrate by irradiating with laser light along the dividing lines, while suppressing occurrence of cracking in the vicinity of the dividing line.SOLUTION: In a first step, damages are formed by irradiating a crystal substrate with laser light along a first dividing line. In a second step following to the first step, damages are formed by irradiating the crystal substrate with laser light along a second dividing line crossing the first dividing line. In a third step following to the second step, damages are formed again by irradiating the crystal substrate with laser light along the second dividing line again. The depth of damages formed in the second step is shallower than the depth of damages formed in the first and third steps.