LIGHT EMITTING DIODE SEALING COMPOSITION, PHOSPHOR SHEET, LED PACKAGE EMPLOYING THE SAME AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To improve luminance of an LED package employing a light emitting diode sealing composition to which fine particles are added.SOLUTION: A light emitting diode sealing composition contains a matrix resin, a phosphor and a plurality of fine particles having different refraction i...

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Bibliographic Details
Main Authors ISHIDA YUTAKA, MATSUMURA NOBUO, SHIGETA KAZUKI, KAWAMOTO KAZUNARI
Format Patent
LanguageEnglish
Published 26.06.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To improve luminance of an LED package employing a light emitting diode sealing composition to which fine particles are added.SOLUTION: A light emitting diode sealing composition contains a matrix resin, a phosphor and a plurality of fine particles having different refraction indices. A concentration of fine particles having a refraction index closest to that of the matrix resin, among the fine particles, in a solid component in the sealing composition is 1 to 30 vol%, and a concentration of the other fine particles in the solid component in the sealing composition is 0.001 to 0.045 vol%.
Bibliography:Application Number: JP20130235622