STRUCTURE AND METHOD OF PRODUCING THE SAME

• Main Authors: OKI HIROAKI, SUWATA OSAMU, NUMATA KOMA, NITTA KOJI, INAZAWA SHINJI, SUGISAWA MASANORI
• Format: Patent
• Language: English
• Published: 26.06.2014
• Subjects: APPARATUS THEREFOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

PROBLEM TO BE SOLVED: To provide a method of producing a structure which is provided with a plating film containing an element having a trivalent or higher valence and being capable of taking a plurality of states of different valences and allows increasing the thickness of the plating film and smoothing the surfaces and a structure obtained by the method.SOLUTION: A method of producing a structure includes a step of preparing a molten salt, a step of preparing a conductive substrate and a step of forming a plating film. In the step of preparing a molten salt, a molten salt containing an element having a trivalent or higher valence and being capable of taking a plurality of states of different valences is prepared. In the step of forming a plating film, with the substrate immersed in the molten salt, a plating film containing the element is formed on the surface of the substrate by a plating method. In the plating step, a step (S21) of growing the plating film on the surface of the substrate by electrifying between the substrate and the molten salt and a step (S22) of adjusting growing conditions for the plating film after stopping the step of growing the plating film are repeated alternately.