HEAT DISSIPATION MEMBER

• Main Authors: HANABUSA KAZUTO, MOCHIZUKI AKIHIRO, FUKUI TAKANOBU
• Format: Patent
• Language: English
• Published: 19.06.2014
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

PROBLEM TO BE SOLVED: To provide a heat dissipation member exhibiting excellent heat dissipation in the thickness direction thereof.SOLUTION: In a heat dissipation member obtained by injection molding a resin composition containing a thermoplastic resin and a high thermal conductivity filler, a planar test piece of 50 mmq.×2 mm, obtained by injection molding the resin composition from a side gate of 10 mm×2 mm, has a thermal conductivity that is higher in the plane direction than in the thickness direction. The heat dissipation member has a lightening portion in the thickness direction thereof, and the lightening portion is formed by injection molding.