EPOXY RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD MADE THEREFROM

• Main Authors: ICHIZAWA YOKO, AITSU SHUJI
• Format: Patent
• Language: English
• Published: 12.06.2014
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

PROBLEM TO BE SOLVED: To provide an epoxy resin composition which requires no advanced agitation skill or no strict control of the storage conditions for materials and has excellent circuit formability while securing the flowability of resin, even with use of inorganic filler having an average particle diameter of 1.5 μm or more and 5.0 μm or less, capable of producing a prepreg without occurrence of aggregation in varnish without requiring advanced dispersion technique.SOLUTION: The epoxy resin composition includes an epoxy resin, an epoxy resin hardening agent, a hardening accelerator, and an amorphous filler. The amorphous filler has an average particle diameter of 1.5 μm or more and 5.0 μm or less, a specific surface area of 4.0 m/g or more and 7.9 m/g or less, and a content ratio of filler having a particle diameter of 10 μm or less of 75 mass% or more. The mass ratio of SiOcomponent to the total addition amount of the amorphous filler is 25% or more.