DYNAMIC QUANTITY SENSOR AND MANUFACTURING METHOD THEREFOR

• Main Authors: SUGIMOTO YOSHIMASA, SAKAI MINEICHI, SAKUTA TAKUYA
• Format: Patent
• Language: English
• Published: 09.06.2014
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT; MEASURING; MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE; MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION,OR SHOCK; PHYSICS; SEMICONDUCTOR DEVICES; TESTING

PROBLEM TO BE SOLVED: To satisfactorily connect a sensor chip and a circuit board via an adhesive.SOLUTION: A pad opening part 20a for exposing a circuit pad 11 is formed in a protective film 20. Also, an adhesive opening part 20b for exposing a prescribed area of a circuit board 10 is formed in the protective film 20. A sensor chip 30 is joined to an adhesive 40 arranged in the adhesive opening part 20b. Consequently, a level difference between the circuit board 10 and protective film 20, in other words, the end part of the adhesive opening 20b restrict spread of the adhesive 40 in the planar direction of the circuit board 10. Accordingly, covering of the circuit pad 11 with the adhesive 40 can be restricted. Additionally, the protective film 20 restricts spread of the adhesive 40 in the planar direction of the circuit board 10. Accordingly, the need to form a specific shape on the circuit board 10 is eliminated, and also a wiring pattern formed on the circuit board 10 is not limited in particular.