RESIN COMPOSITION AND MOLDED PRODUCT FORMED FROM THE SAME

PROBLEM TO BE SOLVED: To provide a resin composition which has improved molding processability in addition to excellent mechanical characteristics.SOLUTION: A resin composition contains a polyamide resin (A), a filler (B) and an adipic acid (C). The adipic acid (C) is 0.1 to 0.5 pts.mass with respec...

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Bibliographic Details
Main Authors ITO AKIRA, FURUKAWA MIKIO, KAIBARA SUSUMU, MASAI YUYA
Format Patent
LanguageEnglish
Published 19.05.2014
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:PROBLEM TO BE SOLVED: To provide a resin composition which has improved molding processability in addition to excellent mechanical characteristics.SOLUTION: A resin composition contains a polyamide resin (A), a filler (B) and an adipic acid (C). The adipic acid (C) is 0.1 to 0.5 pts.mass with respect to total 100 pts.mass of (A) and (B). The resin composition further contains a melt viscosity-lowering agent. The melt viscosity-lowering agent is a polyfunctional allyl compound, a dimer acid-based thermoplastic resin or rosin.
Bibliography:Application Number: JP20120242380