MULTI-CHIP OPTICAL INTEGRATED MODULE

PROBLEM TO BE SOLVED: To provide a multi-chip optical integrated module which is less degraded in optical connection performance and reliability against changes of an environmental temperature and has high functionality and high performance.SOLUTION: In a configuration where thermal expansion displa...

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Main Authors FUKUMITSU TAKAO, OGAWA IKUO, TANOBE HIROMASA, DOI YOSHIYUKI, MIZUNO TAKAYUKI, OOYAMA TAKAHARU, TSUZUKI TAKESHI, MINO SHINJI
Format Patent
LanguageEnglish
Published 08.05.2014
Subjects
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
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Summary:PROBLEM TO BE SOLVED: To provide a multi-chip optical integrated module which is less degraded in optical connection performance and reliability against changes of an environmental temperature and has high functionality and high performance.SOLUTION: In a configuration where thermal expansion displacement of a common fixing member is compensated with thermal expansion displacement of an adjustment member by connection of the common fixing member via the adjustment member, a PLC 110 is fixed to an aluminum sub-mount 134 as the adjustment member. The PLC 110 is stuck onto the aluminum sub-mount 134 with an elastic adhesive 132 and a heat conduction paste 133, and the aluminum sub-mount 134 is mounted on a CuW common mount 131 and has one end part fixed. Thermal expansion displacement of the fixing member common to a pair of optical elements is compensated with the adjustment member, so that a position of an optical connection end can be held independently of fixing for heat release and securing a mechanical strength.
Bibliography:Application Number: JP20120227469