RESIN COMPOSITION, PREPREG, LAMINATE, RESIN SHEET, PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE

• Main Author: TOBISAWA AKIHIKO
• Format: Patent
• Language: English
• Published: 08.05.2014
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

PROBLEM TO BE SOLVED: To provide: a resin composition which exhibits a low linear expansion coefficient and high heat resistance and can provide a cured product excellent in adhesion to a metal layer; and a prepreg, a laminate, a resin sheet, a printed wiring board, and a semiconductor device using the same.SOLUTION: A resin composition comprises: a maleimide compound having at least two maleimide skeletons; an aromatic diamine compound having an aromatic ring structure as well as at least two amino groups; a catalyst comprising a compound represented by the specified general formula (1); and silica.