CONDUCTIVE CONNECTION SHEET, SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To provide: a conductive connection sheet capable of positioning between a terminal included in an electronic component and a terminal included in a circuit board easily with excellent precision, when a metal material is selectively agglomerated between the terminal included in...

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Bibliographic Details
Main Authors KAWASAKI KEI, KAGIMOTO TOMOHIRO, HIRAI MIHOKO
Format Patent
LanguageEnglish
Published 24.04.2014
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Summary:PROBLEM TO BE SOLVED: To provide: a conductive connection sheet capable of positioning between a terminal included in an electronic component and a terminal included in a circuit board easily with excellent precision, when a metal material is selectively agglomerated between the terminal included in the electronic component and the terminal included in the circuit board to electrically connect the terminals together; and a highly reliable semiconductor device and electronic apparatus in which terminals are electrically connected together using the conductive connection sheet.SOLUTION: A conductive connection sheet 1 of the present invention is used for forming a connection to connect a terminal 21 of a semiconductor chip (electronic component) 20 having the terminal (first terminal) 21 and an alignment mark 455 and a second terminal included in an opposite electronic component, and comprises a laminate including a first resin composition layer 11 and a metal layer 12. When the conductive connection sheet 1 is disposed on the semiconductor chip 20, the metal layer 12 includes a defective part 121 having a defect at a position overlapping with the alignment mark 455.
Bibliography:Application Number: JP20120223459