ADHESIVE COMPOSITION, SOLAR CELL MODULE, AND METHOD OF CONNECTING BETWEEN SOLAR CELL AND WIRING
PROBLEM TO BE SOLVED: To provide an adhesive composition having sufficient adhesive strength even if a temperature at thermal compression bonding is lowered (for example, 160°C or less) and the time for thermal compression bonding is shortened (for example, 7 seconds or less).SOLUTION: An adhesive c...
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
21.04.2014
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Subjects | |
Online Access | Get full text |
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Abstract | PROBLEM TO BE SOLVED: To provide an adhesive composition having sufficient adhesive strength even if a temperature at thermal compression bonding is lowered (for example, 160°C or less) and the time for thermal compression bonding is shortened (for example, 7 seconds or less).SOLUTION: An adhesive composition contains (A) acrylate compound, (B) polymerization initiator, and (C) filler. The (A) acrylate compound contains (A1) hydroxy group-containing acrylate compound. The (A1) hydroxy group-containing acrylate compound is blended in an amount of 45 mass% or more and 83 mass% or less, relative to the (A) acrylate compound 100 mass%. |
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AbstractList | PROBLEM TO BE SOLVED: To provide an adhesive composition having sufficient adhesive strength even if a temperature at thermal compression bonding is lowered (for example, 160°C or less) and the time for thermal compression bonding is shortened (for example, 7 seconds or less).SOLUTION: An adhesive composition contains (A) acrylate compound, (B) polymerization initiator, and (C) filler. The (A) acrylate compound contains (A1) hydroxy group-containing acrylate compound. The (A1) hydroxy group-containing acrylate compound is blended in an amount of 45 mass% or more and 83 mass% or less, relative to the (A) acrylate compound 100 mass%. |
Author | IIJIMA TOSHIYUKI SASAKI MASAO KUBOTA NAOKI EIZAI HIROSHI NAKABAYASHI TAKASHI |
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RelatedCompanies | TAMURA SEISAKUSHO CO LTD |
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Snippet | PROBLEM TO BE SOLVED: To provide an adhesive composition having sufficient adhesive strength even if a temperature at thermal compression bonding is lowered... |
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SubjectTerms | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES |
Title | ADHESIVE COMPOSITION, SOLAR CELL MODULE, AND METHOD OF CONNECTING BETWEEN SOLAR CELL AND WIRING |
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