ADHESIVE COMPOSITION, SOLAR CELL MODULE, AND METHOD OF CONNECTING BETWEEN SOLAR CELL AND WIRING

PROBLEM TO BE SOLVED: To provide an adhesive composition having sufficient adhesive strength even if a temperature at thermal compression bonding is lowered (for example, 160°C or less) and the time for thermal compression bonding is shortened (for example, 7 seconds or less).SOLUTION: An adhesive c...

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Bibliographic Details
Main Authors KUBOTA NAOKI, IIJIMA TOSHIYUKI, SASAKI MASAO, EIZAI HIROSHI, NAKABAYASHI TAKASHI
Format Patent
LanguageEnglish
Published 21.04.2014
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
SEMICONDUCTOR DEVICES
USE OF MATERIALS AS ADHESIVES
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Summary:PROBLEM TO BE SOLVED: To provide an adhesive composition having sufficient adhesive strength even if a temperature at thermal compression bonding is lowered (for example, 160°C or less) and the time for thermal compression bonding is shortened (for example, 7 seconds or less).SOLUTION: An adhesive composition contains (A) acrylate compound, (B) polymerization initiator, and (C) filler. The (A) acrylate compound contains (A1) hydroxy group-containing acrylate compound. The (A1) hydroxy group-containing acrylate compound is blended in an amount of 45 mass% or more and 83 mass% or less, relative to the (A) acrylate compound 100 mass%.
Bibliography:Application Number: JP20120218292