TRANSFER MOLDING DEVICE AND TRANSFER MOLDING METHOD

• Main Authors: TACHI SEIYA, NANBA YOSHINORI
• Format: Patent
• Language: English
• Published: 21.04.2014
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

PROBLEM TO BE SOLVED: To provide a transfer molding device for transferring an uneven pattern after extruding an air layer securely.SOLUTION: There is provided a transfer molding device which comprises: a feed processing part 10 for feeding a resin plate J1 to a bucket 80; a vacuum processing part 20 for sucking air inside the bucket 80; heat processing parts 30 and 40 for heating and pressing the bucket 80; a cooling processing part 50 for cooling the bucket 80; a sending processing part 60 for sending a resin plate J2 from the bucket 80; an intermittent rotation part 70 for intermittently rotating the bucket 80 while supporting the bucket 80; and bucket opening and closing means for opening and closing the bucket 80, wherein the processing parts 10 to 60 are each independently provided and arranged on the circumference and each of processes is simultaneously performed for different buckets 80. In the heat processing part 30, the resin plate J1 is pressed while being heated to less than the glass transition temperature and in the heat processing part 40, the resin plate J1 is pressed while being heated to the glass transition temperature or more. The processing in all of the processing parts 10 to 60 is performed by one rotation of the intermittent rotation part 70 and an uneven pattern is transfer-molded on the resin plate J2.