TRANSFER MOLDING DEVICE

PROBLEM TO BE SOLVED: To provide a transfer molding device capable of easily releasing air from between a resin plate and a stamper.SOLUTION: There is provided a transfer molding device which comprises: a bucket 80 for storing a resin plate J and a stamper 823 having an uneven pattern one over the o...

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Bibliographic Details
Main Authors TACHI SEIYA, NANBA YOSHINORI
Format Patent
LanguageEnglish
Published 21.04.2014
Subjects
AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
INFORMATION STORAGE
INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER
PERFORMING OPERATIONS
PHYSICS
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
TRANSPORTING
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Summary:PROBLEM TO BE SOLVED: To provide a transfer molding device capable of easily releasing air from between a resin plate and a stamper.SOLUTION: There is provided a transfer molding device which comprises: a bucket 80 for storing a resin plate J and a stamper 823 having an uneven pattern one over the other; and a vacuum processing part 20 for sucking air inside the bucket 80 and presses the stamper 823 to the resin plate J to transfer-mold the uneven patter on the resin plate J, wherein the stamper 823 comprises: a contact surface 823a in contact with the resin plate J; and a non-contact surface 823b which is formed at a position lower than the contact surface 823a at the periphery of the contact surface 823a and is not in contact with the resin plate J, and the resin plate J is configured to have an outer shape larger than the contact surface 823a.
Bibliography:Application Number: JP20120219815