DIP-SOLDERING FLUX

PROBLEM TO BE SOLVED: To provide a new non-IPA-based dip-soldering flux such as itself does not remain as a residue, without generating a solder ball after soldering, by improving wettability of melting solder metal in the soldering.SOLUTION: The dip-soldering flux is formed by dissolving (B) an org...

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Bibliographic Details
Main Authors YAMANAGA TETSUYA, ISHIGA FUMIO
Format Patent
LanguageEnglish
Published 21.04.2014
Subjects
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:PROBLEM TO BE SOLVED: To provide a new non-IPA-based dip-soldering flux such as itself does not remain as a residue, without generating a solder ball after soldering, by improving wettability of melting solder metal in the soldering.SOLUTION: The dip-soldering flux is formed by dissolving (B) an organic compound having a halogen atom and active hydrogen in a molecule as a strong activator, (C) an aliphatic carboxylic acid having no halogen atom in the molecule as a weak activator and (D) rosin in (A) predetermined high boiling point primary alcohol.
Bibliography:Application Number: JP20120219170