SILICONE COMPOSITION AND ELECTROCONDUCTIVE SILICONE ADHESIVE FORMED BY THE SAME
PROBLEM TO BE SOLVED: To provide a silicone composition for preparing a silicone adhesive having an excellent electroconductivity, in particular.SOLUTION: The prepared composition comprises: an organopolysiloxane including, on the average per molecule, at least two silicon-bonded alkenyl groups; an...
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Format | Patent |
Language | English |
Published |
17.04.2014
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Abstract | PROBLEM TO BE SOLVED: To provide a silicone composition for preparing a silicone adhesive having an excellent electroconductivity, in particular.SOLUTION: The prepared composition comprises: an organopolysiloxane including, on the average per molecule, at least two silicon-bonded alkenyl groups; an organohydrodiene polysiloxane including, on the average per molecule, at least two silicon-bonded hydrogen atoms at a concentration sufficient for curing the provided composition; an electroconductive filler at a quantitative ratio sufficient for conferring electroconductivity onto the silicone adhesive (the filler includes particles having outer surfaces constituted by a metal selected from the group consisting of silver, gold, platinum, palladium, and their alloys); an effective quantity of a hydroxy-functional organic compound having an upper limit molecular weight of 1000 and including at least one hydroxyl group per molecule, assuming that the compound in question includes no acetylenic hydroxyl groups and that the compound in question does not substantially hinder the curing of the composition; and a catalytic quantitative ratio of a hydrosilylation catalyst. |
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AbstractList | PROBLEM TO BE SOLVED: To provide a silicone composition for preparing a silicone adhesive having an excellent electroconductivity, in particular.SOLUTION: The prepared composition comprises: an organopolysiloxane including, on the average per molecule, at least two silicon-bonded alkenyl groups; an organohydrodiene polysiloxane including, on the average per molecule, at least two silicon-bonded hydrogen atoms at a concentration sufficient for curing the provided composition; an electroconductive filler at a quantitative ratio sufficient for conferring electroconductivity onto the silicone adhesive (the filler includes particles having outer surfaces constituted by a metal selected from the group consisting of silver, gold, platinum, palladium, and their alloys); an effective quantity of a hydroxy-functional organic compound having an upper limit molecular weight of 1000 and including at least one hydroxyl group per molecule, assuming that the compound in question includes no acetylenic hydroxyl groups and that the compound in question does not substantially hinder the curing of the composition; and a catalytic quantitative ratio of a hydrosilylation catalyst. |
Author | KLEYER DON L LUTZ MICHAEL ANDREW |
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Snippet | PROBLEM TO BE SOLVED: To provide a silicone composition for preparing a silicone adhesive having an excellent electroconductivity, in particular.SOLUTION: The... |
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SubjectTerms | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES |
Title | SILICONE COMPOSITION AND ELECTROCONDUCTIVE SILICONE ADHESIVE FORMED BY THE SAME |
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