SILICONE COMPOSITION AND ELECTROCONDUCTIVE SILICONE ADHESIVE FORMED BY THE SAME

• Main Authors: LUTZ MICHAEL ANDREW, KLEYER DON L
• Format: Patent
• Language: English
• Published: 17.04.2014
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS AS ADHESIVES

PROBLEM TO BE SOLVED: To provide a silicone composition for preparing a silicone adhesive having an excellent electroconductivity, in particular.SOLUTION: The prepared composition comprises: an organopolysiloxane including, on the average per molecule, at least two silicon-bonded alkenyl groups; an organohydrodiene polysiloxane including, on the average per molecule, at least two silicon-bonded hydrogen atoms at a concentration sufficient for curing the provided composition; an electroconductive filler at a quantitative ratio sufficient for conferring electroconductivity onto the silicone adhesive (the filler includes particles having outer surfaces constituted by a metal selected from the group consisting of silver, gold, platinum, palladium, and their alloys); an effective quantity of a hydroxy-functional organic compound having an upper limit molecular weight of 1000 and including at least one hydroxyl group per molecule, assuming that the compound in question includes no acetylenic hydroxyl groups and that the compound in question does not substantially hinder the curing of the composition; and a catalytic quantitative ratio of a hydrosilylation catalyst.