METHOD FOR MANUFACTURING CIRCUIT CONFIGURATION
PROBLEM TO BE SOLVED: To provide a method for reproducing a print line that is more precise by gravure printing compared to a conventional method, without limitation in the orientation or length of a printed part, and to provide a method for manufacturing a circuit configuration such as an inlet ant...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
10.04.2014
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a method for reproducing a print line that is more precise by gravure printing compared to a conventional method, without limitation in the orientation or length of a printed part, and to provide a method for manufacturing a circuit configuration such as an inlet antenna for an RFID having a precise metal circuit pattern by etching a metal foil by using a resist ink layer formed in a print line state as a mask.SOLUTION: The method for manufacturing a circuit configuration successively includes: (1) a step 1 of printing a resist ink layer having a circuit pattern by applying a resist ink with a gravure printing plate on a top surface of a metal foil; and (2) a step 2 of forming a metal circuit pattern on a resin-containing substrate by etching the metal foil laminated with an adhesive layer on one surface of both surfaces of the resin-containing substrate, by using the resist ink layer as a mask. A line width W mm of the circuit pattern and a number L of screen lines of the gravure printing plate satisfy relational expressions (i) 200≤L≤400 and (ii) L≥35.92/W. |
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Bibliography: | Application Number: JP20120207154 |