DICING-DIE BONDING TAPE AND MANUFACTURING METHOD OF SEMICONDUCTOR CHIP WITH ADHESIVE LAYER

PROBLEM TO BE SOLVED: To provide a dicing-die bonding tape which can improve a pickup property of a semiconductor chip with an adhesive layer.SOLUTION: A dicing-die bonding tape 1 according to the present embodiment comprises: an adhesive layer 3; a non-adhesive layer 4 which is laminated on one sur...

Full description

Saved in:
Bibliographic Details
Main Authors TAKEBE YOSHIYUKI, KAJITA MICHIO
Format Patent
LanguageEnglish
Published 03.04.2014
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
SEMICONDUCTOR DEVICES
USE OF MATERIALS AS ADHESIVES
Online AccessGet full text

Cover

More Information
Summary:PROBLEM TO BE SOLVED: To provide a dicing-die bonding tape which can improve a pickup property of a semiconductor chip with an adhesive layer.SOLUTION: A dicing-die bonding tape 1 according to the present embodiment comprises: an adhesive layer 3; a non-adhesive layer 4 which is laminated on one surface of the adhesive layer 3 and has non-adhesion; an intermediate film 6 laminated on the non-adhesion layer 4 on a surface opposite to the adhesive layer 3 side; and a dicing layer 5 laminated on the intermediate film 6 on a surface opposite to the non-adhesive layer 4 side. A peel force between the non-adhesive layer 4 and the intermediate film 6 is 1 N/25 mm and over.
Bibliography:Application Number: JP20120203023