TRANSFER MECHANISM WITH MULTIPLE WAFER HANDLING CAPABILITY

PROBLEM TO BE SOLVED: To provide apparatuses and methods for improvement in workpiece flowing in a production facility, which can comprise an integration of other functionalities into the object transport movement, thus improving throughput, adding functionalities and reducing footprint.SOLUTION: An...

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Bibliographic Details
Main Authors FARZAD TABRIZI, DAVID BARKER
Format Patent
LanguageEnglish
Published 20.03.2014
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Summary:PROBLEM TO BE SOLVED: To provide apparatuses and methods for improvement in workpiece flowing in a production facility, which can comprise an integration of other functionalities into the object transport movement, thus improving throughput, adding functionalities and reducing footprint.SOLUTION: An integrated robotic mechanism is disclosed for improving transport equipment, and integrating an object movement with other functionalities such as alignment or identification. The disclosed integrated robot assembly can comprise a multiple end effector 14 for moving a plurality of workpieces 16, a single end effector 12 for moving a single workpiece 16, a rotation chuck incorporated on a robot body 10 to provide alignment capability, and an optional identification subsystem for identifying the object during transport. The robot assembly of the present invention can be used in sorter or stocker equipment, processing equipment, and a transfer system.
Bibliography:Application Number: JP20130195892