SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which inhibits cracks of a semiconductor chip and double die pickup by improving pickup performance of the semiconductor chip and inhibits sinking of an end face of an adhesive layer.SOLUTION: A manufacturing method of a se...
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
13.03.2014
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which inhibits cracks of a semiconductor chip and double die pickup by improving pickup performance of the semiconductor chip and inhibits sinking of an end face of an adhesive layer.SOLUTION: A manufacturing method of a semiconductor device 1 comprises: a process of preparing a laminate A in which an adhesive layer 40 containing a radiation curable component is stacked on one surface 30a of a semiconductor wafer 30; a process of cutting the semiconductor wafer 30 of the laminate A by a rotary cutter B into a plurality of individual pieces (chip bodies 13); a process of irradiating the laminate A with radiation rays L from the other surface 30b side of the semiconductor wafer 30; a process of obtaining, from the laminate A, semiconductor chips 10 each including the individual piece 13 of the semiconductor wafer 30 which is cut into a plurality of pieces and irradiated with radiation rays, and a part 14 of the adhesive layer stacked on each of the individual pieces 13; and a process of manufacturing the semiconductor device 1 including the semiconductor chip 10. |
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Bibliography: | Application Number: JP20120185737 |