Ni OR Ni ALLOY SPUTTERING TARGET AND MANUFACTURING METHOD OF THE SAME

• Main Author: MISEKI KENICHIRO
• Format: Patent
• Language: English
• Published: 13.03.2014
• Subjects: CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; FERROUS OR NON-FERROUS ALLOYS; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; TREATMENT OF ALLOYS OR NON-FERROUS METALS

PROBLEM TO BE SOLVED: To provide a Ni or Ni alloy sputtering target suitable for a magnetron sputtering method which may provide uniform deposition on substrates, enabling uniform hardness distribution and uniform leaked magnetic field, and to provide a manufacturing method of the target.SOLUTION: A hot-forged Ni or Ni alloy is formed into a plate body having a predetermined thickness by repeatedly cold-rolling with variation in processing rate. Then, the plate body is annealed before being processed into a predetermined shape to form a target. The target has variation in leaked magnetic flux of 12% or lower on the target surface.