ELECTRONIC CIRCUIT BOARD, ASSEMBLY AND RELATED METHOD THEREOF

PROBLEM TO BE SOLVED: To provide an apparatus that includes a substrate and a plurality of conductive traces formed on the substrate.SOLUTION: Conductive traces 20 are doped with a concentration of an aluminum material, forming a protective layer 26 as a portion of the plurality of conductive traces...

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Bibliographic Details
Main Authors ANDARAWIS EMAD ANDARAWIS, DAVID MULFORD SHADDOCK
Format Patent
LanguageEnglish
Published 27.02.2014
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide an apparatus that includes a substrate and a plurality of conductive traces formed on the substrate.SOLUTION: Conductive traces 20 are doped with a concentration of an aluminum material, forming a protective layer 26 as a portion of the plurality of conductive traces to inhibit oxidation. A set of first metal contact pads 18 are formed in contact with the plurality of conductive traces. The substrate 16, the plurality of conductive traces and the set of first metal contact pads define an electronic circuit board configured to operate at a temperature greater than 200 degrees Celsius. A high operating temperature electronic device is configured in electrical communication with the conductive traces, defining an assembly configured to operate at a temperature greater than 200 degrees Celsius.
Bibliography:Application Number: JP20130156235