SYSTEM AND METHOD FOR TEMPERATURE CONTROL OF SEMICONDUCTOR WAFER
PROBLEM TO BE SOLVED: To provide a system and a method for temperature control of a semiconductor wafer.SOLUTION: The semiconductor wafer is received in a first chamber which is in a first pressure level. A semiconductor wafer is in a first temperature and heated up to a second temperature by a firs...
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
27.02.2014
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a system and a method for temperature control of a semiconductor wafer.SOLUTION: The semiconductor wafer is received in a first chamber which is in a first pressure level. A semiconductor wafer is in a first temperature and heated up to a second temperature by a first heating module. On the other hand, a pressure level in the first chamber is reduced from the first pressure level to a second pressure level. Then, the semiconductor wafer is supplied to a support element of a second chamber which maintains a third pressure level closer to the second pressure level than the first pressure level, and the support element is in a third temperature closer to the second temperature than the first temperature. |
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Bibliography: | Application Number: JP20120280174 |