SUBSTRATE TRANSFER JIG AND SUBSTRATE PROCESSING SYSTEM

PROBLEM TO BE SOLVED: To simplify a device configuration while improving position accuracy in a substrate when the substrate is transferred among a plurality of processing sections.SOLUTION: A carrier C has: a first member 50 constituting a mounting surface for mounting a substrate W on an upper sur...

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Bibliographic Details
Main Author UEHARA JUNICHI
Format Patent
LanguageEnglish
Published 27.02.2014
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Summary:PROBLEM TO BE SOLVED: To simplify a device configuration while improving position accuracy in a substrate when the substrate is transferred among a plurality of processing sections.SOLUTION: A carrier C has: a first member 50 constituting a mounting surface for mounting a substrate W on an upper surface which has a first hollow section 52 disposed below the mounting surface and a plurality of ventilation holes communicating with the first hollow section 52 from the mounting surface; a suction port 61 which can connect the first hollow section 52 to a vacuum source; a vacuum maintaining valve 59 which is arranged between the first hollow section 52 and the suction port 61 and maintains vacuum state of the first hollow section 52 in the state where the upper surface of the plurality of ventilation holes is closed by the substrate W mounted on the mounting surface.
Bibliography:Application Number: JP20120179425