RESIN COMPOSITION AND SHEET

PROBLEM TO BE SOLVED: To provide a resin composition excellent in thermal conductivity and flame retardancy, low in hardness and without bleeding out.SOLUTION: The resin composition comprises: (A) 2-20 mass% of a copolymer including a conjugated diene unit and a vinyl aromatic compound unit and/or a...

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Bibliographic Details
Main Authors MOTOI YASUAKI, NAGANUMA KENJI
Format Patent
LanguageEnglish
Published 20.02.2014
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:PROBLEM TO BE SOLVED: To provide a resin composition excellent in thermal conductivity and flame retardancy, low in hardness and without bleeding out.SOLUTION: The resin composition comprises: (A) 2-20 mass% of a copolymer including a conjugated diene unit and a vinyl aromatic compound unit and/or a hydrogenated object thereof; (B) 2-20 mass% of a softener 20 for rubber; and (C) 70-95 mass% of a thermally conductive filler. The content of the vinyl aromatic compound unit in the (A) component is less than 20 mass%, and a mass ratio ((A)/(B)) of the (A) component to the (B) component is 35/65-60/40.
Bibliography:Application Number: JP20120173424