WIRE BONDING STRUCTURE AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a wire bonding structure such that an arrangement of boards can be freely set, and a method of manufacturing the same.SOLUTION: A first circuit board 10 having a first land part 11 formed on a side face 10a and a second circuit board 20 having a second land part 21 f...

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Bibliographic Details
Main Author TAKASAKI HAJIME
Format Patent
LanguageEnglish
Published 03.02.2014
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To provide a wire bonding structure such that an arrangement of boards can be freely set, and a method of manufacturing the same.SOLUTION: A first circuit board 10 having a first land part 11 formed on a side face 10a and a second circuit board 20 having a second land part 21 formed thereon are arranged at a predetermined angle, and the first land part 11 and second land part 21 are connected by wire bonding.
Bibliography:Application Number: JP20120158402