SHIELD FILM AND SHIELD PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide a shield film which has good shield characteristics in a high frequency region of the shield film, and to provide a shield printed wiring board.SOLUTION: A shield film 1 is provided on a flexible printed wiring board 8 including a base film 5 where a signal circuit 6...

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Bibliographic Details
Main Authors TAJIMA HIROSHI, YAMAUCHI SHIRO, HARUNA YUSUKE, UENO KENJI
Format Patent
LanguageEnglish
Published 03.02.2014
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PERFORMING OPERATIONS
PRINTED CIRCUITS
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To provide a shield film which has good shield characteristics in a high frequency region of the shield film, and to provide a shield printed wiring board.SOLUTION: A shield film 1 is provided on a flexible printed wiring board 8 including a base film 5 where a signal circuit 6a is formed and an insulation film 7 which is provided on an entire surface of the base film 5 covering the signal circuit 6a. The shield film 1 includes: a conductive adhesive layer 15 laminated on an entire surface of the insulation film 7; and a metal layer 11 laminated on an entire surface of the conductive adhesive layer 15.
Bibliography:Application Number: JP20120157785