POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE

• Main Authors: IEDA SHINJI, HINOTO YU
• Format: Patent
• Language: English
• Published: 30.01.2014
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

PROBLEM TO BE SOLVED: To provide a polyamide resin composition and a molded article excellent in strength, rigidity after water absorption (water absorption rigidity), rigidity at high temperature use (rigidity when being heated and moldability), having good moldability, low molding condition dependence to various moldability such as warpage, and excellent in appearance.SOLUTION: A polyamide resin composition contains (A) a copolymerized polyamide containing (a) a unit containing an alicycle dicarboxylic acid, (b) a unit containing a diamine having 8 or more carbon atoms, (c) a unit containing at least one kind of a copolymerized component selected from a group consisting of following (c-1) to (c-3), (c-1) a dicarboxylic acid other than the alicycle dicarboxylic acid of above (a), (c-2) a diamine having less number of carbon atoms than the diamine of above (b), (c-3) lactam and/or an amino carboxylic acid, and satisfying a given requirement in terms of a crystallization peak temperature T, a glass transformation temperature T, and a melting peak temperature Tand T, and (B) an inorganic filler.