ACOUSTIC WAVE DEVICE BUILT-IN MODULE AND COMMUNICATION DEVICE

• Main Author: TAJIMA MOTOYUKI
• Format: Patent
• Language: English
• Published: 23.01.2014
• Subjects: BASIC ELECTRONIC CIRCUITRY; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC COMMUNICATION TECHNIQUE; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; RESONATORS; TRANSMISSION

PROBLEM TO BE SOLVED: To provide an acoustic wave device built-in module which inhibits moisture etc. from intruding into a cavity on an electrode exciting an acoustic wave, and to provide a communication device.SOLUTION: An acoustic wave device built-in module includes: a multilayer wiring board 12 where an insulation layer 14 and a wiring layer 16 are laminated; multiple acoustic wave devices 20 which are incorporated into the multilayer wiring board 12; and an antenna switch 40 provided on the multilayer wiring board 12 and electrically connected with the acoustic wave device 20. Each acoustic wave device 20 includes: an IDT0 that is an electrode provided on a piezoelectric substrate 22 and exciting an acoustic wave; and a sealing part 28 including a frame 24, which is provided on the piezoelectric substrate 22 enclosing the IDT0, and a lid 26 which is provided on the frame 24 so as to have a cavity 30 on the IDT0. The lid 26 is recessed toward the piezoelectric substrate 22 side.