ACOUSTIC WAVE DEVICE BUILT-IN MODULE AND COMMUNICATION DEVICE

PROBLEM TO BE SOLVED: To provide an acoustic wave device built-in module which inhibits moisture etc. from intruding into a cavity on an electrode exciting an acoustic wave, and to provide a communication device.SOLUTION: An acoustic wave device built-in module includes: a multilayer wiring board 12...

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Bibliographic Details
Main Author TAJIMA MOTOYUKI
Format Patent
LanguageEnglish
Published 23.01.2014
Subjects
BASIC ELECTRONIC CIRCUITRY
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
RESONATORS
TRANSMISSION
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Summary:PROBLEM TO BE SOLVED: To provide an acoustic wave device built-in module which inhibits moisture etc. from intruding into a cavity on an electrode exciting an acoustic wave, and to provide a communication device.SOLUTION: An acoustic wave device built-in module includes: a multilayer wiring board 12 where an insulation layer 14 and a wiring layer 16 are laminated; multiple acoustic wave devices 20 which are incorporated into the multilayer wiring board 12; and an antenna switch 40 provided on the multilayer wiring board 12 and electrically connected with the acoustic wave device 20. Each acoustic wave device 20 includes: an IDT0 that is an electrode provided on a piezoelectric substrate 22 and exciting an acoustic wave; and a sealing part 28 including a frame 24, which is provided on the piezoelectric substrate 22 enclosing the IDT0, and a lid 26 which is provided on the frame 24 so as to have a cavity 30 on the IDT0. The lid 26 is recessed toward the piezoelectric substrate 22 side.
Bibliography:Application Number: JP20130179701