UNDERFILL AGENT FOR CAMERA MODULE

PROBLEM TO BE SOLVED: To provide an underfill agent for a camera module, capable of suppressing generation of foreign substances when a cleaning process is performed after the underfill agent is used to seal.SOLUTION: An underfill agent for a camera module includes: (A) a liquid epoxy resin; (B) an...

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Bibliographic Details
Main Authors ARAO KEI, HONMA HIROKI, IMAI KAZUNARI
Format Patent
LanguageEnglish
Published 23.01.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PICTORIAL COMMUNICATION, e.g. TELEVISION
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide an underfill agent for a camera module, capable of suppressing generation of foreign substances when a cleaning process is performed after the underfill agent is used to seal.SOLUTION: An underfill agent for a camera module includes: (A) a liquid epoxy resin; (B) an unsaturated alicyclic acid anhydride having a molecular weight of 200-300; (C) a latent hardener; (D) an inorganic filler; and (E) a coupling agent.
Bibliography:Application Number: JP20120150611