FILM DEPOSITION METHOD

• Main Authors: IRIYAMA YASUHISA, FUCHIDA HIDETSUGU
• Format: Patent
• Language: English
• Published: 20.01.2014
• Subjects: APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; PERFORMING OPERATIONS; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SPRAYING OR ATOMISING IN GENERAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a film deposition method capable of depositing a fine particle of relatively large particle diameter on a base material more easily in a simple configuration.SOLUTION: The film deposition method comprises: storing a fine particle, on which a coating layer easier to be charged than a base material is formed on the base material, in a sealed container 2; generating an aerosol A of the fine particle by introducing a gas to the sealed container 2; transferring the aerosol A to a film deposition chamber 3 which is maintained at lower pressure than the sealed container via a conveyance pipe 6 which is connected to the sealed container 2 and has a nozzle 18 on a tip while discharging the particle by friction against an inner surface of the conveyance pipe; injecting the aerosol A from the nozzle 18; and depositing the charged fine particle on the base material S stored in the film deposition chamber 3.