COOLING DEVICE

• Main Author: NAGASAWA HIDEO
• Format: Patent
• Language: English
• Published: 09.01.2014
• Subjects: BASIC ELECTRIC ELEMENTS; BLASTING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HEAT EXCHANGE IN GENERAL; HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT; HEATING; LIGHTING; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MECHANICAL ENGINEERING; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; WEAPONS

PROBLEM TO BE SOLVED: To provide a cooling device which optimally and efficiently cools a number of electronic substrates mounted in a narrow space.SOLUTION: A cooling device 1 of this invention is attached to an electronic substrate on which heating units 8, 9 are mounted. The cooling device 1 includes a flat plate like heat diffusion part 2, and a surface of the heat diffusion part 2 thermally contacts with a first circuit mounting surface 5 of the electronic substrate. In the heat diffusion part 2, heat from the heating unit 8, 9 is diffused by vaporization and condensation of a refrigerant sealed therein. In the electronic substrate, the heating units 8, 9 are mounted on the first circuit mounting surface 5. The heat diffusion part 2 thermally contacts with the heat units 8, 9 mounted on the first circuit mounting surface 5, and the first circuit mounting surface 5 is a mounting surface facing the heat diffusion part 2 in the electronic substrate.