POLISHING COMPOSITION AND METHOD FOR MANUFACTURING SUBSTRATE USING THE SAME

PROBLEM TO BE SOLVED: To provide a polishing composition capable of reducing surface defects of a polishing target object composed of a crystalline metal compound, the polishing composition used in applications for polishing such a polishing target object, and a method for manufacturing a substrate...

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Bibliographic Details
Main Authors SERIKAWA MASAYUKI, KUBO MEGUMI, MORINAGA HITOSHI
Format Patent
LanguageEnglish
Published 09.01.2014
Subjects
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DRESSING OR CONDITIONING OF ABRADING SURFACES
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
PERFORMING OPERATIONS
POLISHES
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To provide a polishing composition capable of reducing surface defects of a polishing target object composed of a crystalline metal compound, the polishing composition used in applications for polishing such a polishing target object, and a method for manufacturing a substrate using the polishing composition.SOLUTION: There is provided a polishing composition which contains abrasive grains and water and is used in applications for polishing a polishing target object composed of a crystalline metal compound, wherein the polishing composition further contains a surface absorbent and reduces surface defects compared with a polishing composition without containing the surface absorbent.
Bibliography:Application Number: JP20120137979