SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

• Main Author: FUKUTANI KEITA
• Format: Patent
• Language: English
• Published: 26.12.2013
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To secure the adhesion between a mold resin and an insulation sheet in a semiconductor device with a double side heat radiation structure, and to provide a manufacturing method of the semiconductor device with the double side heat radiation structure which secures the adhesion between the mold resin and the insulation sheet.SOLUTION: A semiconductor device 100 with a double side heat radiation structure, in which heat of a semiconductor element 10 having electrodes 11 on both surfaces is radiated from both surfaces, includes: the semiconductor elements 10; heat sinks 20 respectively connected with the electrodes 11; a mold resin 60 which exposes a part of each heat sink 20 as a heat radiation surface 21 and seals the semiconductor elements 10 and the heat sinks 20; and insulation sheets 40 which respectively cover the heat radiation surfaces 21. The mold resin 60 is provided with recessed parts 60a located positions enclosing the heat radiation surfaces 21 on both surfaces on which the heat radiation surfaces 21 are exposed. The insulation sheet 40 covers an entire portion of each heat radiation surface 21 and end parts of the insulation sheet 40 respectively adhere into the recessed parts 60a.