SEMI-AROMATIC POLYAMIDE RESIN COMPOSITION

• Main Authors: ANADA ARIHIRO, TAMURA KOZO, MIYAKE MUNEHIRO, MUNESAWA YUJI
• Format: Patent
• Language: English
• Published: 26.12.2013
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

PROBLEM TO BE SOLVED: To provide a semi-aromatic polyamide resin composition that is optimal to obtain a film in which a foreign matter fault of a fish eye or the like is decreased, and that has excellent mechanical strength.SOLUTION: A semi-aromatic polyamide resin composition includes: 0.01-0.5 pt.mass of a biphenyl bisphosphonate-based phosphorus-based heat stabilizer; and 0.01-0.5 pt.mass of a hindered phenol-based thermal stabilizer that has a structure shown by general formula (II) and in which a pyrolysis temperature at 5% of weight loss when subjected to temperature rise by 20°C/minute under the nitrogen atmosphere is at least 350°C, based on 100 pts.mass of a semi-aromatic polyamide resin (excluding the semi-aromatic polyamide resin consisting of a dicarboxylic acid component that contains at least 60% by mole of terephthalic acid, and an aliphatic diamine component that contains at least 60% by mole of a 9C aliphatic diamine) whose melting point is at least 300°C. In the formula, Rand Reach independently denote a methyl group, an ethyl group or hydrogen.