PRODUCTION PROCESS FOR ADHESIVE FILM AND PRODUCTION PROCESS FOR FLEXIBLE METAL-CLAD LAMINATE

• Main Authors: FUJIWARA HIROSHI, MATSUWAKI TAKAAKI, ONO KAZUHIRO
• Format: Patent
• Language: English
• Published: 12.12.2013
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; PERFORMING OPERATIONS; POLISHES; PRINTED CIRCUITS; TRANSPORTING; USE OF MATERIALS AS ADHESIVES

PROBLEM TO BE SOLVED: To provide a production process for adhesive film allowing to obtain a flexible metal-clad laminate inhibited from occurrence of a dimensional change when made by a lamination method, and a production process for the flexible metal-clad laminate obtained by bonding a metal film to the adhesive film.SOLUTION: A production process for adhesive film includes a step of conveying a gel film in a heating oven while fixing both of its ends, wherein part of the step includes a step of conveying the gel film while fixing the film so that there is substantially no tension of the film in the transverse direction, or a step of conveying the gel film in the heating oven while fixing both of its ends, and after the step, a step of heating the film with both ends being unfixed. Coefficients of linear expansion of the adhesive film satisfy 1.0>(coefficient of MD linear expansion)/(coefficient of TD linear expansion)>0.1 (the coefficients of linear expansion are the values at 100-200°C).