JOINT PAD, PROBE ASSEMBLY, AND METHOD FOR MANUFACTURING JOINT PAD

PROBLEM TO BE SOLVED: To provide a joint pad where temperature measurement accuracy of a minute joint part is improved and which can join an object to be joined with stable quality.SOLUTION: A joint pad is provided with: a pad part 16 comprising first metal; a joint part 13 which is formed on an upp...

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Bibliographic Details
Main Authors SATO TOMOYA, TAZAWA MASAHISA
Format Patent
LanguageEnglish
Published 09.12.2013
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
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Summary:PROBLEM TO BE SOLVED: To provide a joint pad where temperature measurement accuracy of a minute joint part is improved and which can join an object to be joined with stable quality.SOLUTION: A joint pad is provided with: a pad part 16 comprising first metal; a joint part 13 which is formed on an upper surface of the pad part 16 in the way that an upper surface of one end side of the pad part 16 is exposed and comprises a second metal so as to join an object to be joined by being irradiated with laser beam; and a radiation part 15 which is formed by oxidizing at least a part of the upper surface of one end side of the pad part 16, comprises a metallic oxide, and has emissivity higher than the first and second metals.
Bibliography:Application Number: JP20120121970