PLASMA REACTOR EQUIPPED WITH DYNAMICALLY ADJUSTABLE PLASMA SOURCE OUTPUT APPLYING DEVICE

• Main Authors: IBRAHIM M IBRAHIM, DARIN BIVENS, SHEEBA J PANAYIL, RICHARD LEWINGTON, RENEE KOCH, AJAY KUMAR, MICHAEL N GRIMBERGEN, MADHAVI R CHANDRACHOOD
• Format: Patent
• Language: English
• Published: 28.11.2013
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a plasma reactor having improved uniformity.SOLUTION: The plasma reactor includes a process chamber 100, a workpiece support base 120, a process gas injection device 135, a vacuum pump 145, a plasma source output applying device 160 composed of an inside coil 162 and an outside coil 164. The outside coil 164 is configured to be capable of being tilted around a radial direction axis line perpendicular to a symmetric axis line by controlling a pair of decentering ring 200 composed of an upper ring 202 and a lower ring 204, and to be capable of rotating at least an outside applying device part around the symmetric axis line. The inside coil 162 is configured to be capable of moving in a vertical direction along the symmetric vertical axis line by a vertical translation motor 224.