METHOD FOR REPLENISHING TO TIN-BASED PLATING SOLUTION

• Main Author: FUJIMURA KAZUMASA
• Format: Patent
• Language: English
• Published: 07.11.2013
• Subjects: APPARATUS THEREFOR; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PROBLEM TO BE SOLVED: To provide a method for preventing clouding of liquid by eliminating generation of stannic oxide, when stannous ion component is replenished to tin-based plating solution (tin or tin alloy plating liquid).SOLUTION: In a method for replenishing supplemental liquid containing stannous ion to a tin-based plating solution when performing electric tin-based plating with the tin-based plating solution by using an insoluble anode, stannous hydroxide, surfactant and oxygen scavenger are contained in the supplemental liquid. By compositely feeding the oxygen scavenger and the surfactant into the supplemental liquid, the surfactant acts upon the hydroxide to eliminate contact to oxygen, and antioxidation action of the hydroxide by the oxygen scavenger is synergistically enforced, and the plating liquid is easily managed by replenishing under the condition of no cloudiness. Further, this replenishing method can be applied to the replenishment to electroless tin-based plating solution.