SCRATCH RESISTANT STRUCTURE

PROBLEM TO BE SOLVED: To provide a structure including film satisfying both excellent scratch resistance and excellent processability.SOLUTION: A structure includes (a) 1 to 50 mass% of a polymer containing a structural unit originated from a urethane bond-containing diol (meth)acrylate compound and...

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Bibliographic Details
Main Authors KYO YOSHITETSU, KINOSHITA SHUHEI, TOYODA MOMOKO
Format Patent
LanguageEnglish
Published 07.11.2013
Subjects
ADHESIVES
CHEMICAL PAINT OR INK REMOVERS
CHEMISTRY
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS
CORRECTING FLUIDS
DYES
FILLING PASTES
INKS
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
PASTES OR SOLIDS FOR COLOURING OR PRINTING
PERFORMING OPERATIONS
POLISHES
TRANSPORTING
USE OF MATERIALS THEREFOR
WOODSTAINS
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Summary:PROBLEM TO BE SOLVED: To provide a structure including film satisfying both excellent scratch resistance and excellent processability.SOLUTION: A structure includes (a) 1 to 50 mass% of a polymer containing a structural unit originated from a urethane bond-containing diol (meth)acrylate compound and having a specific weight-average molecular weight, (b) 1 to 50 mass% of at least one compound selected from the group consisting of a silicate compound, an organic titanium compound, an organozirconium compound or their hydrolytic condensates, (c) 1 to 80 mass% of organic solvent including a glycol ether and/or an alcohol, (d) 1 to 80 mass% of water, and (e) 0.1 to 10 mass% of a chelate ligand, and is formed by applying a film-forming composition having (5:95) to (60:40) mass ratio of the component (a) to the component (b) on the surface of a substrate material and baking it to have a film of 0.1 to 20 g/mcoated amount. The structure can be utilized in various applications, including automobile industries, consumer electric industries and electric electronic industries.
Bibliography:Application Number: JP20120101229