PACKAGING OF POLYSILICON
PROBLEM TO BE SOLVED: To provide a packaging method causing neither the crash-through of a usual plastic bag material nor the breakage of the bag to prevent the pollution of polysilicon.SOLUTION: In a method of packaging the polysilicon of a pulverized form or a round rod, at least one film in each...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
28.10.2013
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a packaging method causing neither the crash-through of a usual plastic bag material nor the breakage of the bag to prevent the pollution of polysilicon.SOLUTION: In a method of packaging the polysilicon of a pulverized form or a round rod, at least one film in each respective case is inserted in a cubic corrugated card board box suitable for a dimension of the polysilicon to be packaged. The polysilicon is introduced to at least one film, and at least one film having a thickness of 10 to 1,000 μm is welded to wrap the polysilicon. At least one film is enclosed by the other film having a reinforcement structure or a forming element. |
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Bibliography: | Application Number: JP20130085923 |