PACKAGING OF POLYSILICON

PROBLEM TO BE SOLVED: To provide a packaging method causing neither the crash-through of a usual plastic bag material nor the breakage of the bag to prevent the pollution of polysilicon.SOLUTION: In a method of packaging the polysilicon of a pulverized form or a round rod, at least one film in each...

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Bibliographic Details
Main Authors JOACHIM MATTES, LICHTENEGGER BRUNO, MATTHIAS VIETZ
Format Patent
LanguageEnglish
Published 28.10.2013
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Summary:PROBLEM TO BE SOLVED: To provide a packaging method causing neither the crash-through of a usual plastic bag material nor the breakage of the bag to prevent the pollution of polysilicon.SOLUTION: In a method of packaging the polysilicon of a pulverized form or a round rod, at least one film in each respective case is inserted in a cubic corrugated card board box suitable for a dimension of the polysilicon to be packaged. The polysilicon is introduced to at least one film, and at least one film having a thickness of 10 to 1,000 μm is welded to wrap the polysilicon. At least one film is enclosed by the other film having a reinforcement structure or a forming element.
Bibliography:Application Number: JP20130085923