SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING SOLID-STATE IMAGING DEVICE, AND ELECTRONIC DEVICE

• Main Authors: MIZUTA KYOHEI, OKA OSAMU
• Format: Patent
• Language: English
• Published: 17.10.2013
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC COMMUNICATION TECHNIQUE; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PICTORIAL COMMUNICATION, e.g. TELEVISION; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To improve light receiving characteristics in a solid-state imaging device of a 3D structure in which a sensor substrate with a photoelectric conversion part and a circuit substrate with a driving circuit are laminated; to provide a method of manufacturing the solid-state imaging device; and to provide an electronic device using the solid-state imaging device.SOLUTION: A connection part 50 electrically connecting a sensor substrate 2 to a circuit substrate 9 is provided on the side of a light receiving surface S of the semiconductor substrate 2. An insulating layer 14 covering the connection part 50 is made thin at least in a pixel region 4. A cross-sectional shape of a step part 38 of the insulating layer 14 or a planar shape of a convex portion of the insulating layer 14 formed by the step part 38 is designed to reduce fluid pressure of an organic material applied on the insulating layer 14.