COATING AGENT FOR SEMICONDUCTOR

PROBLEM TO BE SOLVED: To provide a coating agent for a semiconductor that comprises a thermoplastic polyamide imide in which an imidization ring closure process or a heat curing reaction with a crosslinking agent can be eliminated to lead to simplification of a manufacturing process.SOLUTION: There...

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Bibliographic Details
Main Authors SHINO KATSUYA, IENE TAKEHISA, HATTORI TAKAHIRO
Format Patent
LanguageEnglish
Published 10.10.2013
Subjects
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMICAL PAINT OR INK REMOVERS
CHEMISTRY
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS
COMPOSITIONS BASED THEREON
CORRECTING FLUIDS
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FILLING PASTES
INKS
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
PASTES OR SOLIDS FOR COLOURING OR PRINTING
POLISHES
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF MATERIALS THEREFOR
WOODSTAINS
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Summary:PROBLEM TO BE SOLVED: To provide a coating agent for a semiconductor that comprises a thermoplastic polyamide imide in which an imidization ring closure process or a heat curing reaction with a crosslinking agent can be eliminated to lead to simplification of a manufacturing process.SOLUTION: There are provided: a coating agent for a semiconductor that comprises dissolving a polyamideimide resin that includes a trimellitic anhydride as an acid component and bitrilene diisocyanate as a diisocyanate component as main constituting elements into a solvent including an amide based solvent as a principal ingredient by a solid concentration from 5 wt% to 30 wt%; and a resin film that comprises the coating agent for a semiconductor.
Bibliography:Application Number: JP20120080267