METHOD OF MANUFACTURING WAFER SLICING SAW WIRE AND WAFER SLICING SAW WIRE

PROBLEM TO BE SOLVED: To manufacture a saw wire capable of efficiently slicing a wafer, and improving the accuracy of a cut surface.SOLUTION: An inlet side and an outlet side of an original wire 10 are fluctuated in a corrugation direction crossing a running direction D1 by a wire fluctuating part 2...

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Bibliographic Details
Main Authors TOKUNAGA YUKINOBU, SUETSUGU TAKAMICHI, ITO TOSHIAKI
Format Patent
LanguageEnglish
Published 07.10.2013
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To manufacture a saw wire capable of efficiently slicing a wafer, and improving the accuracy of a cut surface.SOLUTION: An inlet side and an outlet side of an original wire 10 are fluctuated in a corrugation direction crossing a running direction D1 by a wire fluctuating part 23 while being run by giving a tension to a through-hole 21a of a corrugating chip 21 through an original wire 10 before corrugation. Accordingly, the original wire 10 is corrugated to obtain the saw wire 11. The saw wire 11 has the preferable strength required for slicing operation even though the same is thinned, and subtle corrugation can be maintained even during slicing operation. Therefore, the wafer can be efficiently sliced and the accuracy of the cut surface of the wafer is improved.
Bibliography:Application Number: JP20120075567