ELECTRONIC DEVICE AND ELECTRONIC DEVICE MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide an electronic device which is manufactured at low cost, which has resistance against stress such as deformation and resistance against weather, and which has good reliability; and provide a manufacturing method of the electronic device.SOLUTION: An electronic device...

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Bibliographic Details
Main Authors SATO KEIJI, TAKEUCHI HITOSHI, NUMATA SATOSHI, NAKAMURA NORIHIKO, ARATAKE KIYOSHI
Format Patent
LanguageEnglish
Published 19.09.2013
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide an electronic device which is manufactured at low cost, which has resistance against stress such as deformation and resistance against weather, and which has good reliability; and provide a manufacturing method of the electronic device.SOLUTION: An electronic device 1 comprises: a glass substrate 10; internal wiring 30 provided on a top face of the glass substrate 10; an electronic component 50 mounted on the glass substrate 10 and electrically connected to the internal wiring 30; a through electrode 20 with one end being connected to the internal wiring 30; an insulation resin layer 70 formed on an undersurface of the glass substrate 10 having a uniform thickness on a position at a distance from another end of the through electrode 20; and a conductive resin layer 80 stacked so as to be connected to the insulation resin layer 70 and the other end of the through electrode 20.
Bibliography:Application Number: JP20120049615