SEMICONDUCTOR LIGHT EMITTING DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR LIGHT EMITTING DEVICE, LEAD FRAME, AND MANUFACTURING METHOD OF LEAD FRAME

PROBLEM TO BE SOLVED: To inhibit the deterioration of the reflection rate due to sulfidation of a coat and improve the connection reliability of a mounting wire.SOLUTION: A semiconductor light emitting device includes: a lead frame 10 where an electric joint layer 2 and a light reflection layer 4 ar...

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Main Authors MIWA TAKAO, OKABE NORIO, WAJIMA MINEO, WADAYAMA YOSHIHIDE, CHINDA SATOSHI, INO MASANOBU, KAWANOBE SUNAO, TAKAHATA KAZUHIRO
Format Patent
LanguageEnglish
Published 12.09.2013
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To inhibit the deterioration of the reflection rate due to sulfidation of a coat and improve the connection reliability of a mounting wire.SOLUTION: A semiconductor light emitting device includes: a lead frame 10 where an electric joint layer 2 and a light reflection layer 4 are laminated on a base material in this order; a semiconductor light emitting element 5 mounted on the lead frame 10; and a mounting wire 7 where one end is connected with an electrode of the semiconductor light emitting element 5 and at least a part of the other end penetrates through the light reflection layer 4 and is directly joined to the electric joint layer 2.
Bibliography:Application Number: JP20120046517